Emerald Performance Materials has developed new, patent pending, technology in reactive liquid polymers (RLP) epoxy adduct syntheses.  These adducts do not separate when diluted with standard DGEBA (diglycidyl ether of bisphenol A) resins and, when formulated into an adhesive, provide excellent low temperature properties.  Typical adducts of Hypro® 1300X8 CTBN and 1300X13 CTBN give good room temperature performance but the low temperature performance is typically lacking.  Adducts of Hypro® 2000X162 CTB give good low temperature performance, but the rubber portion separates upon ageing.  The new technology combines the good room temperature performance of CTBN with improved low temperature properties due to the presence of CTB in the adduct.  CTB has the lowest Tg (glass transition temperature) in the RLP product line.

Preliminary work suggests that these CTB/CTBN-epoxy adducts are not as effective in two component amine cured epoxy adhesives as they are in dicyandiamide cured epoxy adhesives.

Generally the rubber modified epoxy resins introduced here can be used in paste and film structal adhesives, for the production of various specific articles, components, and structural forms in numerous applications such as binding automotive and aerospace components.  The toughened epoxy adhesives are desirable in any material or bonding application requiring excellent low temperature toughness as well as impact resistance.

For more information contact the Hubron Sales Office or use the contact form.